The architecture of the C165 combines advantages of both RISC and CISC processors and of advanced peripheral subsystems in a very well-balanced way. The following block diagram gives an overview of the different on-chip components and of the advanced, high bandwidth internal bus structure of the C165.
Ambient temperature under bias (TA):
SAB-C165-LM, SAB-C165-RM, SAB-C165-LF, SAB-C165-RF ... 0 to + 70 °C
SAF-C165-LM................................................................... 40 to + 85 °C
Storage temperature (TST) ........................................... 65 to + 150 °C
Voltage on VCC pins with respect to ground (VSS)............ 0.5 to + 6.5 V
Voltage on any pin with respect to ground (VSS) ....... 0.5 to VCC + 0.5 V
Input current on any pin during overload condition.......... 10 to + 10 mA
Absolute sum of all input currents during overload condition ........|100 mA|
Power dissipation.............................................................................. 1.5 W
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. During overload conditions (VIN > VCC or VIN < VSS) the
voltage on pins with respect to ground (VSS) must not exceed the values defined by the Absolute Maximum Ratings.
Required Field 
